A Novel Scalable Approach to Solid Metal Microneedle Fabrication via an Automated Modified Wire Bonding Process

Haider, Syed Kazim

A Novel Scalable Approach to Solid Metal Microneedle Fabrication via an Automated Modified Wire Bonding Process

dc.contributor.advisor	Dalton, Colin
dc.contributor.author	Haider, Syed Kazim
dc.contributor.committeemember	Kim, Seonghwan (Sam)
dc.contributor.committeemember	Jones, Steven
dc.contributor.committeemember	Park, Simon
dc.date.accessioned	2024-01-17T22:19:35Z
dc.date.available	2024-01-17T22:19:35Z
dc.date.issued	2024-01-15
dc.description.abstract	Hypodermic needles have played a pivotal role in medical treatments; however, their use often incites fear due to pain and tissue trauma. Microneedle arrays present a promising alternative, with their smaller size resulting in reduced pain and trauma, however they have faced manufacturing scale-up challenges due to the complex microfabrication processes involved, precluding their widespread adoption into clinical practice. This research introduces a novel microneedle fabrication method utilizing a modified wire bonding process, enabling rapid iteration of designs on a single automated system. Key fabrication parameters, such as loop settings and wire bonding capillary shape, were explored to understand their impact on microneedle geometry. This study finds how specific wire bonding parameters can influence microneedle tip sharpness, crucial for efficient skin penetration. Additionally, the research delves into how these parameters affect microneedle length, a crucial factor for delivering drugs to a sufficient depth below skin. A significant aspect of this work involved investigating three different bonding wire diameters (25, 33, and 50 µm). The findings revealed that the largest diameter, 50 µm, exhibited optimal performance in terms of robustness, and had the least tendency to bend upon insertion into porcine skin tissue, and the lowest failure rate during microneedle fabrication. Initial tests on porcine skin validated the effective penetration ability of the wire bonded microneedles. A computational simulation was also developed to illustrate how the unique tip shapes, achievable through wire bonding, can enhance skin penetration. This iterative process, encompassing simulation, fabrication, and testing, underscores the potential of this novel fabrication method as a versatile platform technology. This research lays a solid foundation for broad applications, paving the way for future optimizations and adaptations tailored to specific microneedle requirements for different applications.
dc.identifier.citation	Haider, S. K. (2024). A novel scalable approach to solid metal microneedle fabrication via an automated modified wire bonding process (Master's thesis, University of Calgary, Calgary, Canada). Retrieved from https://prism.ucalgary.ca.
dc.identifier.uri	https://hdl.handle.net/1880/117980
dc.language.iso	en
dc.publisher.faculty	Graduate Studies
dc.publisher.institution	University of Calgary
dc.rights	University of Calgary graduate students retain copyright ownership and moral rights for their thesis. You may use this material in any way that is permitted by the Copyright Act or through licensing that has been assigned to the document. For uses that are not allowable under copyright legislation or licensing, you are required to seek permission.
dc.subject	Microneedles
dc.subject	Microneedle array
dc.subject	Wire bonding
dc.subject	Ball bonding
dc.subject	Additive fabrication process for microneedle arrays
dc.subject	Microfabrication
dc.subject	bioMEMS
dc.subject	Microarray patch
dc.subject	Solid metal microneedles
dc.subject	Metal microneedles
dc.subject.classification	Engineering--Biomedical
dc.subject.classification	Engineering
dc.title	A Novel Scalable Approach to Solid Metal Microneedle Fabrication via an Automated Modified Wire Bonding Process
dc.type	master thesis
thesis.degree.discipline	Engineering – Biomedical
thesis.degree.grantor	University of Calgary
thesis.degree.name	Master of Science (MSc)
ucalgary.thesis.accesssetbystudent	I require a thesis withhold – I need to delay the release of my thesis due to a patent application, and other reasons outlined in the link above. I have/will need to submit a thesis withhold application.