Micromachined Chip Scale Thermal Sensor for Thermal Imaging

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dc.contributor.authorShekhawat, Gajendra
dc.contributor.authorRamachandran, Srinivasan
dc.contributor.authorJiryaei Sharahi, Hossein
dc.contributor.authorSarkar, Souravi
dc.contributor.authorHujsak, Karl
dc.contributor.authorLi, Yuan
dc.contributor.authorHagglund, Karl
dc.contributor.authorKim, Seonghwan
dc.contributor.authorAden, Gary
dc.contributor.authorChand, Ami
dc.contributor.authorDravid, Vinayak
dc.date.accessioned2018-10-29T17:42:57Z
dc.date.available2018-10-29T17:42:57Z
dc.date.issued2018-02-05
dc.description.abstractThe lateral resolution of scanning thermal microscopy (SThM) has hitherto never approached that of mainstream atomic force microscopy, mainly due to poor performance of the thermal sensor. Herein, we report a nanomechanical system-based thermal sensor (thermocouple) that enables high lateral resolution that is often required in nanoscale thermal characterization in a wide range of applications. This thermocouple-based probe technology delivers excellent lateral resolution (∼20 nm), extended high-temperature measurements >700 °C without cantilever bending, and thermal sensitivity (∼0.04 °C). The origin of significantly improved figures-of-merit lies in the probe design that consists of a hollow silicon tip integrated with a vertically oriented thermocouple sensor at the apex (low thermal mass) which interacts with the sample through a metallic nanowire (50 nm diameter), thereby achieving high lateral resolution. The efficacy of this approach to SThM is demonstrated by imaging embedded metallic nanostructures in silica core–shell, metal nanostructures coated with polymer films, and metal–polymer interconnect structures. The nanoscale pitch and extremely small thermal mass of the probe promise significant improvements over existing methods and wide range of applications in several fields including semiconductor industry, biomedical imaging, and data storage.en_US
dc.identifier.citationShekhawat, G. S., Ramachandran, S., Jiryaei Sharahi, H., Sarkar, S., Hujsak, K., Li, Y., ... & Dravid, V. P. (2018). Micromachined Chip Scale Thermal Sensor for Thermal Imaging. ACS nano, 12(2), 1760-1767.en_US
dc.identifier.doi10.1021/acsnano.7b08504en_US
dc.identifier.doihttp://dx.doi.org/10.11575/PRISM/35045
dc.identifier.urihttp://hdl.handle.net/1880/108930
dc.language.isoenen_US
dc.publisherAmerican Chemical Societyen_US
dc.publisher.facultySchulich School of Engineeringen_US
dc.publisher.hasversionPost-printen_US
dc.publisher.institutionUniversity of Calgaryen_US
dc.publisher.institutionNorthwestern Universityen_US
dc.publisher.institutionAPPNANOen_US
dc.publisher.institutionApplied NanoStructures, Inc.en_US
dc.publisher.policyhttps://pubs.acs.org/page/4authors/jpa/index.htmlen_US
dc.rightsUnless otherwise indicated, this material is protected by copyright and has been made available with authorization from the copyright owner. You may use this material in any way that is permitted by the Copyright Act or through licensing that has been assigned to the document. For uses that are not allowable under copyright legislation or licensing, you are required to seek permission.en_US
dc.subjectmetallic nanostructuresen_US
dc.subjectnanomechanical thermal sensoren_US
dc.subjectSTHmen_US
dc.subjecttemperature mappingen_US
dc.subjectthermal conductivity mappingen_US
dc.subjectthermal imagingen_US
dc.subjectVertiSenseen_US
dc.titleMicromachined Chip Scale Thermal Sensor for Thermal Imagingen_US
dc.typejournal articleen_US
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